* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
2U 4 Nodes - Rear access
440 x 87 x 820
Motherboard
MZ61-HD0
CPU
AMD EPYC™ 7002 series processor family
Dual processors, 7nm, Socket SP3
Up to 64-core, 128 threads per processor
TDP up to 200W

Compatible with AMD EPYC™ 7001 series processor family

NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Socket
Per Node:
2 x LGA 4094
Total:
8 x LGA 4094
Socket SP3
Chipset
System on Chip
Memory
Per node:
16 x DIMM slots

Total:
64 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
Memory speed: Up to 3200*/ 2933 MHz

- Note:
* Follow BIOS setting and memory QVL list if running 3200 Mhz
LAN
Per node:
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
1 x Dedicated management port

Total:
8 x 1GbE LAN ports (1 x Intel® I350-AM2)
4 x Dedicated management ports
1 x 10/100/1000 *CMC global management port

*CMC: Chassis Management Controller, to monitor all status of computing nodes
Video
Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Audio
-
Storage
Per node:
2 x 2.5" U.2, 4 x SATA/SAS hot-swappable HDD/SSD bays

Total:
8 x 2.5" U.2, 16 x SATA/SAS hot-swappable HDD/SSD bays
SAS card is required for SAS devices support
RAID
Depends on RAID card (in option)
Peripheral Drives
-
Expansion Slots
Per node:
2 x Half-length low-profile slots with PCIe x16 (Gen3 x16 bus) from CPU_0
1 x OCP mezzanine slot with PCIe Gen3 x16 bus from CPU_0
2 x M.2 slots from CPU_0 and CPU_1:
- M-key
- PCIe Gen3 x4
- Supports NGFF-2242/2260/2280/22110 cards
- CPU TDP is limited to 120W if using M.2 device

Total:
8 x Half-length low-profile slots with PCIe x16 (Gen3 x16 bus) from CPU_0
4 x OCP mezzanine slots with PCIe Gen3 x16 bus from CPU_0
8 x M.2 slots from CPU_0 and CPU_1:
- M-key
- PCIe Gen3 x4
- Supports NGFF-2242/2260/2280/22110 cards
- CPU TDP is limited to 120W if using M.2 device
Internal I/O
Per node:
2 x M.2 slots
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED

Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
*1 x CMC status LED

*Only one CMC status LED per system
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x RJ45 MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x RJ45 MLAN
4 x ID LEDs
*1 x CMC global management port

*Only one CMC global management port per system
Backplane I/O
24 x ports
12Gb/s & 6Gb/s compatible
TPM
1 x TPM header with LPC interface
Optional TPM2.0 kit: CTM000
Power Supply
2 x 2200W redundant PSUs
80 PLUS Platinum

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V
+12.12V/ 178.1A
+12Vsb/ 3.5A

NOTE:
* The system power supply requires C19 type power cord
* 2000W 80 PLUS Titanium PSU as an option
System Management
Aspeed® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • JAVA Based Serial Over LAN
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
For AMD EPYC™ 7002 series processor family

Windows Server 2016 ( X2APIC/256T not supported)
Windows Server 2019

Red Hat Enterprise Linux 7.6 ( x64) or later
Red Hat Enterprise Linux 8.0 ( x64) or later

SUSE Linux Enterprise Server 12 SP4 ( x64) or later
SUSE Linux Enterprise Server 15 SP1 ( x64) or later

Ubuntu 16.04.6 LTS (x64) or later
Ubuntu 18.04.3 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later

VMware ESXi 6.5 EP15 or later
VMware ESXi 6.7 Update3 or later
VMware ESXi 7.0 or later

Citrix Hypervisor 8.1.0 or later

For AMD EPYC™ 7001 series processor family

Windows Server 2012 R2 with Update
Windows Server 2016

Red Hat Enterprise Linux 7.4 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later

SUSE Linux Enterprise Server 11.4 (x64) or later
SUSE Linux Enterprise Server 12.3 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later

Ubuntu 16.04 LTS (x64) or later
Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later

VMware ESXi 6.5 Update1 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later
Weight
35 kg (full packaging)
System Fans
8 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
1167 X 700 X 309 mm
Packaging Content
1 x H261-Z61
8 x CPU heatsinks
1 x Rail Kit
Part Numbers
Barebone package: 6NH261Z61MR-00-A*
Spare parts:
- Motherboard: 9MZ61HD0NR-00-2*
- Rail kit: 25HB2-NJ2102-N1R/ 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-44320H-A0R/25ST1-44320I-A0R
- Back plane board: 9CBPH0O0NR-00
- Power Supply: 25EP0-222001-D0S
- C19 type power cord 125V/15A (US): 25CP1-018000-Q0R (optional extra)
- C19 type power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional extra)
- Ring topology kit: 6NH23NR48SR-00 (in option)
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

SUPPORT

  • Choose your OS
  • Choose your OS
  • Windows Server 2019
  • Windows Server 2016 64bit
網路介面
Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.

什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。

  • Choose your OS
  • Choose your OS
  • Windows Server 2019
  • Windows Server 2016 R2 64bit
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Windows Server 2012 64bit
  • Windows 10 64bit
  • VMware
  • Ubuntu
  • Linux CentOS
  • Linux
工具程式
說明
版本
檔案大小
日期
GSM CLI
Version : 2.1.44
114.54 MB
2021/03/06
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019
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